Special Issue on Wafer Bonding and Its Applications
Guest Editor, Qin-Yi Tong (Ziptronix, Inc.)

Research Reports

Room Temperature Direct Wafer Bonding for Three Dimensional Integrated Sensors (SM0609)
Paul Enquist, p.307
[Abstract (PDF File) | Full text (PDF File)]

Locating and Tracking the Evolution of Debonds at the Interface of Bonded Semiconductor Devices Using Infrared Photoelasticity (SM0610)
Gavin Horn, Thomas J. Mackin and Jon Lesniak, p.317
[Abstract (PDF File) | Full text (PDF File)]

Effects of Implantation Heating on Exfoliation of InP (SM0611)
Sumiko Hayashi, Rajinder Sandhu, David Bruno, Mike Wojtowicz and Mark S. Goorsky, p.335
[Abstract (PDF File) | Full text (PDF File)]

Introduction of InP-Based Light Emitter into GaAs-Based 3D Photonic Crystal by Improved Wafer Bonding of Dissimilar Materials (SM0612)
Masahiro Imada, Shinpei Ogawa, Susumu Yoshimoto and Susumu Noda, p.343
[Abstract (PDF File) | Full text (PDF File)]